Wafer Dicing Blades (DISCO DAD SERIES)

Description

1. Product Overview

The Wafer Dicing Blades (DISCO DAD Series) are precision electroformed or sintered diamond cutting tools engineered specifically for the singulation of semiconductor wafers, MEMS devices, and compound substrates. Their primary industrial use is in back-end semiconductor fabrication, where they separate individual dies from a wafer with micron-level kerf control and minimal chipping. The key value proposition is a unique balance of ultra-high dimensional stability and aggressive cut life, delivering a 15–20% reduction in total cost of ownership (TCO) compared to generic alternatives. Strategically, these blades are critical for yield optimization in advanced packaging (e.g., fan-out WLP, 3D ICs), where edge quality directly dictates device reliability.

2. Key Specifications & Technical Characteristics

• Material Composition: Cubic boron nitride (cBN)-enhanced synthetic diamond grit (grain size: 1–30 µm) embedded in either a nickel-plated electroformed bond (for thin kerf) or a resin/phenolic sintered bond (for heavy stock removal).

• Purity Level / Grade: Semiconductor-grade diamond, 99.9+% traceable origin; free of ferrous contaminants (≤ 10 ppm metallic impurities).

• Physical Characteristics:

  • Form: Annular disk with precision-ground edge.

  • Color: Silver nickel (electroformed) or dark grey (resin bond).

  • Particle size distribution: Tight d50 tolerance ±0.5 µm.

  • Density: >98% theoretical density for uniform wear.

• Packaging Options: Single-blade vacuum-sealed anti-static clamshells; multi-blade (10/25/50 units) gel-packed desiccated cartridges; ISO Class 5 cleanroom double-bagged.

• Shelf Life: 24 months from date of manufacture when stored at 20–25°C / <40% RH, away from ozone.

3. Core Industrial Applications

• Primary Industries: Semiconductor foundries, OSATs (outsourced assembly & test), MEMS manufacturers, LED/sapphire substrate producers, and automotive power device fabs (SiC, GaN).

• Specific Operational Use Cases:

  • Full-cut dicing of 300mm silicon wafers (low-k dielectric stacks).

  • Partial-cut scribing of GaAs wafers for RF devices.

  • Singulation of thin (≤50µm) wafers mounted on dicing tape.

• Performance vs. Alternatives: Compared to standard blades, the DISCO DAD Series exhibits 40% lower chipping on low-k materials and 2x longer blade life on hard ceramics (e.g., Al₂O₃, ZrO₂) due to optimized grit exposure rate.

• Efficiency/Cost Advantages: Reduced need for dressing cuts (non-productive time drops by 30%) and lower water consumption through proprietary cooling-channel geometry.

4. Competitive Advantages

• Quality Consistency: Lot-to-lot runout control ≤ 2µm TIR (total indicated runout); each blade 100% interferometry-inspected.

• Supply Reliability: Direct partnership with DISCO-grade raw diamond sources; safety stock held in three global hubs (Asia, EU, NA) – 48-hour emergency dispatch available.

• Logistics Capability: Temperature-controlled, shock-monitored shipping; certified for air and sea freight with full Incoterms 2024 support.

• Price Competitiveness: Tiered pricing model that undercuts OEM-direct pricing by 12–18% for equivalent DAD series SKUs, with volume breakpoints at 50/200/500 units.

• Environmental & Technical Support: ROHS 3 & REACH SVHC compliant; free life-cycle analysis (LCA) provided; 24/7 process engineering support with spindle run-in calibration guides.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): 20 units per SKU (mixed sizes allowed within same bond type).

• BULK 20MT Loading Capacity: Not applicable for blades (dimensional weight). Equivalent bulk: One 20FT container holds max 4,800 individually packed blades (240 master cartons).

• Metric per Container: 20FT container: 240 master cartons (4,800 blades). 40FT HC container: 520 master cartons (10,400 blades).