Tantalum pentachloride (TaCl₅)

Description

1. Product Overview

Tantalum pentachloride (TaCl₅) is a high-purity, anhydrous chloride precursor essential for the production of tantalum metals, coatings, and electronic-grade intermediates. Its primary industrial use lies in chemical vapor deposition (CVD) for semiconductor barriers and as a feedstock for tantalum powder used in high-performance capacitors. The key value proposition is its consistently low oxygen content and high reactivity, enabling superior film uniformity and conductivity. Strategically, it is critical for advanced electronics, aerospace alloys, and corrosion-resistant components, where material failure is not an option.

2. Key Specifications & Technical Characteristics

• Chemical composition: Tantalum pentachloride (TaCl₅), ≥99.9% purity (metals basis)

• Purity grade: Electronic grade (99.9% – 99.999%) available; standard industrial grade ≥99.9%

• Physical characteristics:

  • Form: Fine crystalline powder

  • Color: Pale yellow to off-white

  • Melting point: 216–218°C

  • Boiling point: 242°C (sublimes)

  • Density: 3.68 g/cm³ (at 25°C)

  • Moisture sensitivity: Extremely hygroscopic – must be handled under inert gas

• Packaging options:

  • 1 kg, 5 kg, 25 kg tamper-evident aluminum-lined drums

  • 100 kg stainless steel canisters with PTFE seals

  • Custom bulk packaging under argon blanketing

• Shelf life: 12 months when stored below 30°C in original unopened containers with desiccant

3. Core Industrial Applications

• Primary industries: Semiconductor manufacturing, passive electronic components, specialty alloys, aerospace coatings, chemical process equipment

• Specific use cases:

  • CVD precursor for TaN and Ta₂O₅ diffusion barriers in logic and memory chips

  • Feedstock for high-purity tantalum powder (capacitor anodes)

  • Chlorination route to tantalum metal for superalloys and sputtering targets

  • Anti-corrosion coatings for chemical reactors

• Performance advantage vs. alternatives:

  • Lower oxygen content (<50 ppm) vs. oxychloride-mixed grades → fewer defects in thin films

  • Higher sublimation consistency → repeatable CVD deposition rates

  • Direct chlorination yields lower residual impurities than fluoride-based routes

• Cost/efficiency benefit: Reduces post-process purification steps by up to 20%, lowers precursor waste in CVD by 15% due to uniform vapor transport

4. Competitive Advantages

• Quality consistency: Batch-to-batch ICP-OES and XRD validation; certificate of analysis (CoA) included with every shipment

• Supply reliability: Multi-source tantalum feedstock (conflict-free, audited supply chain); redundant manufacturing lines ensure >99% on-time delivery

• Logistics capability: Inert-atmosphere packaging and temperature-controlled logistics; global warehousing in North America, EU, and Asia

• Price competitiveness: Long-term contracts with tantalum miners enable stable quarterly pricing; volume-based discounts for >1 MT/year

• Sustainability: Closed-loop chlorine recovery process reduces chemical waste by 40% vs. industry average; full REACH and RoHS compliance documentation

• Technical support: Dedicated application engineers for CVD process optimization; safety data sheets (SDS) and handling protocols in 12 languages

5. Commercial & Supply Information

• Minimum order quantity (MOQ): 5 kg for standard grade; 1 kg for electronic grade

• BULK loading capacity: 20 MT (20 metric tons) per full container load (FCL) – equivalent to 20,000 kg

• Loading density per container:

  • 20-ft container: 16 MT net (palletized drums)

  • 40-ft container: 20 MT net maximum

• Lead time: 14–21 days from order confirmation for bulk orders; spot orders within 5 days from regional hubs