Octafluorocyclobutane (C₄F₈) – semiconductor etch gas

£27,000.00

Product Overview
Octafluorocyclobutane (C₄F₈) is a high-purity fluorocarbon gas engineered for advanced semiconductor plasma etching and dielectric deposition processes. It delivers precise anisotropic etching performance, making it ideal for manufacturing integrated circuits, MEMS devices, and flat-panel displays. With excellent chemical stability and consistent composition, it ensures repeatable process outcomes in high-volume fabrication environments.

Competitive Advantage Spotlight
C₄F₈ stands out for its superior etch selectivity, low residue formation, and tight purity specifications, enabling higher yield and reduced downtime in critical semiconductor operations.

Description

1. Product Overview

Octafluorocyclobutane (C₄F₈) is a high-purity fluorocarbon gas engineered for precision plasma etching processes in advanced semiconductor manufacturing. It is primarily used in dielectric and silicon-based etching, where controlled anisotropy and high selectivity are critical. The product delivers exceptional process stability, enabling consistent feature definition at nanoscale geometries. As device architectures continue to shrink, C₄F₈ has become strategically indispensable for next-generation microelectronics, supporting high-yield fabrication and process reproducibility in leading-edge fabs.


2. Key Specifications & Technical Characteristics

  • Chemical Composition: Perfluorinated cyclic compound (C₄F₈)
  • Purity Level / Grade: ≥ 99.99% (Electronic Grade); higher purities available upon request
  • Physical Characteristics:
    • Form: Compressed liquefied gas
    • Color: Colorless
    • Odor: Slightly sweet
    • Molecular Weight: 200.03 g/mol
    • Density: ~8.4 kg/m³ (gas at standard conditions)
  • Moisture Content: ≤ 5 ppm (typical for semiconductor grade)
  • Packaging Options:
    • High-pressure steel cylinders (40L, 47L)
    • ISO tanks for bulk supply
    • Tube trailers for large-volume delivery
  • Shelf Life: Stable under recommended storage conditions; no significant degradation over extended periods

3. Core Industrial Applications

  • Primary Industries:
    • Semiconductor fabrication (IC manufacturing, MEMS)
    • Flat panel display (FPD) production
    • Photovoltaic cell manufacturing
  • Operational Use Cases:
    • Plasma etching of silicon dioxide (SiO₂) and low-k dielectrics
    • Deep reactive ion etching (DRIE) processes
    • Sidewall passivation in high-aspect-ratio etching
  • Performance Advantages:
    • Enables superior anisotropic etching with precise profile control
    • High selectivity over photoresist and underlying layers
    • Reduced polymer deposition compared to alternative fluorocarbons
    • Enhances process repeatability and throughput efficiency

4. Competitive Advantages

  • Quality Consistency: Ultra-high purity standards ensure minimal contamination and defect rates
  • Supply Reliability: Robust global sourcing network with redundant production capabilities
  • Logistics Capability: Flexible delivery formats with optimized handling for semiconductor fabs
  • Price Competitiveness: Scalable production enabling cost efficiencies for high-volume buyers
  • Sustainability: Optimized production processes with reduced emissions and compliance with environmental regulations
  • Technical Support: Comprehensive documentation (CoA, SDS) and process optimization support available

5. Commercial & Supply Information

  • Minimum Order Quantity (MOQ): BULK 20 MT
  • Loading Capacity:
    • Approx. 20–22 MT per ISO tank container
    • Customizable based on packaging configuration and destination logistics

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