Hydrogen Peroxide (H2O2 SEMICONDUCTOR GRADE)

Description

1. Product Overview

Hydrogen Peroxide (H₂O₂) Semiconductor Grade is an ultra-high-purity oxidizing agent engineered specifically for critical wet etching, wafer cleaning, and photoresist stripping in semiconductor fabrication. This product delivers near-zero metallic contaminants and sub-ppb particulate control, directly enabling yield optimization for advanced nodes (≥28nm to sub-5nm). As global chip demand outstrips supply, securing a reliable source of semiconductor-grade H₂O₂ is a strategic supply-chain imperative to avoid fab downtime and costly requalification cycles.

2. Key Specifications & Technical Characteristics

• Chemical Composition: Hydrogen Peroxide (H₂O₂) in deionized water

• Purity Level / Grade: Semiconductor Grade (SEMI C30-1118 compliant); typical purity 30% or 31% w/w

• Maximum Impurities (per batch):

  • Each metal contaminant (Al, Ca, Cr, Cu, Fe, K, Mg, Mn, Na, Ni, Pb, Zn): ≤0.1 ppb

  • Anions (Chloride, Nitrate, Phosphate, Sulfate): ≤0.1 ppm

  • Total Organic Carbon (TOC): ≤1 ppm

• Physical Form: Clear, colorless liquid

• Density: Approx. 1.11 g/mL (at 20°C, 30% solution)

• pH (as is): 2.5–3.5 (typical for unstabilized or ultra-low stabilizer variants)

• Packaging Options:

  • 200L fluorinated HDPE drums (double-bagged in Class 100 cleanroom)

  • 1000L IBCs with particulate filters at outlet

  • ISO tank containers (20,000L) for bulk direct-to-fab distribution

• Shelf Life: 12 months from date of manufacture (when stored ≤25°C, away from light and catalysts)

3. Core Industrial Applications

• Primary Industries: Semiconductor manufacturing (foundries, IDMs), MEMS, flat-panel display, advanced LED and photovoltaic (high-end PERC/topcon cells)

• Specific Operational Use Cases:

  • SC-1 (RCA clean) with NH₄OH for particle and organic residue removal

  • SC-2 (RCA clean) with HCl for heavy metal desorption

  • Piranha clean (with H₂SO₄) for photoresist stripping and organic residue oxidation

  • Post-CMP cleaning to remove polishing slurry particles

• Performance vs. Alternatives: Unlike electronic-grade (EL) or general industrial H₂O₂, semiconductor grade eliminates trace metals that cause junction leakage and gate oxide defects. Compared to ozone-based cleaning, it delivers superior particle removal efficiency (PRE >99.5% on 0.1µm particles) without damaging sensitive low-k dielectrics.

• Efficiency/Cost Advantage: Consistent purity reduces requalification frequency, lowers defect density (D0), and increases overall fab OEE. A single particulate excursion can cost >$1M in scrapped wafers — our grade reduces that risk.

4. Competitive Advantages

• Quality Consistency: ISO 9001:2015 and IATF 16949 certified production with real-time SPC; each batch includes ICP-MS and ion chromatography certificate of analysis (CoA).

• Supply Reliability: Multiple redundant manufacturing sites (Asia, Europe, North America) with dedicated semiconductor supply chains — no repurposing from industrial or medical grades.

• Logistics Capability: Temperature-controlled, static-safe fluorinated packaging; dedicated fleet with GPS tracking and deviation alarms.

• Price Competitiveness: Long-term take-or-pay contracts and spot volumes available; direct-from-manufacturer pricing removes distributor markup.

• Sustainability: Lower stabilizer content (or stabilizer-free options) reduces downstream waste treatment costs; recyclable IBCs and ISO tank leasing available.

• Technical Support: 24/7 application engineering, on-site purity audits, and co-development for next-generation cleaning formulations.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): 4 x 200L drums (800 kg) for initial qualification samples; full bulk thereafter.

• Bulk 20MT Loading Capacity: 20 MT net weight per 20-ft ISO tank container (approx. 18,000 liters of 30% H₂O₂).

• Incoterms & Lead Time: EXW, FOB, CIF available; 2–3 weeks lead time for drums/IBCs, 4 weeks for ISO tanks (subject to container availability).