Product Overview
This High‑Purity Copper Foil is a precision-engineered, rolled annealed copper foil meeting ASTM B152 and IPC‑4562 standards, designed for advanced electronic applications where signal integrity and thermal management are critical. Primary uses include printed circuit boards (PCBs), lithium‑ion battery anodes, electromagnetic shielding, and high‑frequency substrates. The key value proposition is near‑zero defect density and exceptional thickness uniformity (±2%), which directly reduces short‑circuit risks and improves etching yields. Strategically, this product enables miniaturization and higher power density in electronics, making it indispensable for 5G, EV, and renewable energy systems.

Key Specifications & Technical Characteristics

• Chemical Composition: Cu ≥ 99.95%, Oxygen ≤ 0.02%, trace impurities (Ag, Fe, Sn, Pb, Ni) tightly controlled per IPC‑4562 Class 3

• Purity Grade: 3N5 (99.95%) – 4N (99.99%) available upon request

• Physical Characteristics: Electro-deposited (ED) or rolled annealed (RA); thickness range 6µm – 105µm; width up to 1,380 mm; matte/shiny finish option; tensile strength 25–45 kg/mm²; elongation 2–15%

• Packaging Options: Anti‑tarnish interleaved paper, vacuum‑sealed spools (15–150 kg), wooden reels or shrink‑wrapped pallets with moisture barrier

• Shelf Life: 12 months when stored in original packaging at 15–30°C, RH ≤ 60%, away from acidic/corrosive atmospheres

Core Industrial Applications

• Primary Industries: Consumer electronics, automotive electronics (EV/HEV), energy storage systems, aerospace avionics, telecom infrastructure

• Operational Use Cases: Multi‑layer PCB inner/outer layers, flexible printed circuits (FPC), high‑current bus bars, lithium‑ion battery tab and negative current collector

• Performance Advantages: Superior etch factor tolerances reduce undercutting by 18% vs. industry standard; low profile treatment (LPT) surface enables fine‑line circuits down to 25µm L/S; high‑temperature stability (180°C for 1,000 hours) prevents delamination in automotive and industrial power modules

• Efficiency/Cost Advantage: Consistent roll‑to‑roll flatness lowers lamination scrap rate by 25% and improves automated assembly throughput

Competitive Advantages

• Quality Consistency: 100% eddy current and pinhole inspection; SPC‑controlled rolling with COA for every master coil

• Supply Reliability: Multi‑source production lines in Asia and Europe; 48‑hour emergency dispatch for qualified buyers

• Logistics Capability: Dedicated B2B export packaging (wooden crates with shock and humidity indicators); TÜV‑certified warehouse network

• Price Competitiveness: Direct mill pricing with volume‑based tiered discounts; long‑term supply contracts available

• Sustainability: 92% recycled copper content in selected grades; ISO 14001 and RoHS/REACH compliance

• Technical Support: On‑call metallurgists; pre‑shipment sample validation (3-meter trial spool); full material traceability from ingot to coil

Commercial & Supply Information

• Minimum Order Quantity (MOQ): BULK 20MT (mix of thickness/width variants allowed)

• Loading Capacity: 22–24 MT per 20‑foot dry container (standard palletized reels, 1,200 mm × 1,000 mm footprint)