Cerium Oxide Nano Polishing Powder (CeO2-99.9)

Description

1. Product Overview

Cerium Oxide Nano Polishing Powder (CeO₂-99.9) is a high-purity ceria-based polishing material engineered for precision surface finishing and ultra-fine polishing applications. Its controlled nanoscale particle characteristics deliver high polishing efficiency, excellent surface quality, and reduced risk of deep scratches compared with conventional coarse abrasives. The product is strategically important for advanced glass, optics, electronics, semiconductor, and precision-component manufacturing where consistent surface finish and process control are critical.

2. Key Specifications & Technical Characteristics

• Chemical Composition: Cerium Oxide (CeO₂)
• Purity: ≥99.9%
• Grade: High-purity nano polishing grade
• Form: Fine powder
• Color: Typically pale yellow to light cream
• Particle Size: Nanoscale; specification can be customized according to polishing-process requirements
• Density: Typically approximately 7.0–7.3 g/cm³
• Surface Characteristics: High chemical-mechanical polishing activity with controlled abrasive action
• Packaging Options: 1 kg, 5 kg, 25 kg bags/drums; customized bulk packaging available
• Shelf Life: Typically 24 months when sealed and stored in a cool, dry environment
• Documentation: Certificate of Analysis (CoA), technical data sheet, and applicable quality documentation available upon request

3. Core Industrial Applications

• Optical Glass & Precision Optics: Fine polishing of lenses, prisms, mirrors, and optical components requiring high clarity and low surface roughness.
• Display & Specialty Glass: Used for precision finishing of glass substrates, covers, and high-performance glass components.
• Semiconductor & Electronics: Supports controlled surface polishing and finishing of precision substrates and electronic components.
• Automotive Glass & Components: Applied where smooth, defect-minimized surfaces and consistent finishing performance are required.
• Precision Ceramics & Advanced Materials: Suitable for finishing technical ceramics and other hard surfaces requiring controlled abrasive performance.
• Industrial Polishing Compounds: Functions as a high-performance active abrasive in formulated polishing slurries and compounds.

Its combination of high purity, fine particle characteristics, and strong polishing activity enables efficient material removal while supporting smooth, uniform surfaces and reduced polishing defects.

4. Competitive Advantages

• Quality Consistency: ≥99.9% CeO₂ purity and controlled particle characteristics support repeatable polishing performance.
• Supply Reliability: Structured bulk sourcing supports continuous industrial production and long-term procurement programs.
• Logistics Capability: Available in standardized and customized packaging suitable for international containerized shipments.
• Price Competitiveness: High-performance nano ceria provides an efficient balance between polishing performance, consumption, and total process cost.
• Process Efficiency: High chemical-mechanical activity can improve polishing rates while supporting fine surface finishes.
• Sustainability: Efficient abrasive utilization can help reduce material consumption and polishing waste compared with less-effective abrasive systems.
• Technical Support: Product specifications, CoA, technical documentation, and customized particle-size or packaging requirements can be provided for qualified industrial buyers.
• Strategic Sourcing Value: A reliable source of high-purity cerium oxide enables manufacturers to strengthen polishing-process consistency, supply continuity, and cost control.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): BULK 20 MT
• Loading Capacity: Approximately 20–25 MT per 20-foot container, subject to packaging configuration, product density, and applicable shipping restrictions
• Supply Format: Bulk industrial supply with customized packaging and shipment arrangements available