Sputtering Targets (Ta / Ti / Cu 5N)

Description

1. Product Overview

This product family comprises high-purity Tantalum (Ta), Titanium (Ti), and Copper (Cu) sputtering targets, each certified at 99.999% (5N) purity. They are precision-engineered for physical vapor deposition (PVD) processes in semiconductor wafer fabrication, advanced packaging, and high-performance thin-film coatings. The strategic value lies in minimizing thin-film defect densities (particles & voids) and ensuring batch-to-batch electrical uniformity—critical factors directly impacting semiconductor yield and device reliability in 12-inch wafer fabs and beyond.

2. Key Specifications & Technical Characteristics

Chemical Composition & Purity

• Ta (Tantalum): 99.999% (5N) – Base metal balance; trace metal analysis via GDMS.

• Ti (Titanium): 99.999% (5N) – Residual resistivity ratio (RRR) >100 available.

• Cu (Copper): 99.999% (5N) – Oxygen content <5 ppm, alkali metals <1 ppm each.

Physical Characteristics

• Form: Planar rectangular, circular, or rotary (cylindrical) targets.

• Color/Density: Ta (grey, 16.65 g/cc), Ti (silver, 4.51 g/cc), Cu (red-orange, 8.94 g/cc).

• Grain Size: ≤50 µm (customizable: 10–100 µm for sputtering uniformity).

• Geometric Tolerance: Flatness ≤0.5 mm/m; surface roughness Ra ≤0.4 µm.

Packaging

• Class 10 (ISO 4) cleanroom assembled. Double vacuum-sealed in inert gas with moisture barrier. Outer: ESD-safe rigid plastic or aluminum laminate bag + certified cleanroom carton.

Shelf Life

• 36 months from date of analysis when stored in original unopened packaging at 15–25 °C, <30% RH.

3. Core Industrial Applications

Why this product outperforms alternatives:
The 5N purity eliminates micro-arcs caused by alkali metal inclusions. Our controlled grain structure reduces random target erosion, extending target life by 18–25% compared to unoptimized 5N equivalents.

4. Competitive Advantages

• Quality Consistency: Each target batch is accompanied by a CoA (lot traceable) with full GDMS analysis and density mapping. Incoming raw material triple-assayed.

• Supply Reliability: Dual-source agreement for base metal stock (US, JP, KR origins). Typical lead time: 15–20 days for standard sizes; safety stock held in EU/US/SEA hubs.

• Logistics Capability: Cleanroom-to-cleanroom chain with real-time temperature/humidity logging. Express dispatch available for fab-down emergencies.

• Price Competitiveness: Direct ownership of sputtering target bonding line (indium/epoxy-free bonds available). Eliminates two intermediary margins vs. resold products.

• Sustainability: Ta/Ti from conflict-free, RMI-compliant smelters. Cu from >95% recycled feedstock upon request. 100% target back-machining service for end-of-life substrate reclamation.

• Technical Support: Free sputtering yield modeling for your chamber geometry (Canon ANELVA, ULVAC, Applied Materials, TEL, Evatec). Bonding validation included.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ):

  • Ta: 1 target (≥2 kg equivalent)

  • Ti: 1 target (≥3 kg equivalent)

  • Cu: 1 target (≥5 kg equivalent)
    *Test-grade 6″ diameter single targets available at 50% MOQ for qualification.*

• BULK 20MT Loading Capacity:
  Not applicable – sputtering targets are high-value, low-volume.
  Equivalent consolidation:

  • Full 20′ container (palletized): Max 1.8 MT total (due to dense materials + packaging).

  • Actual practical limit per shipment: 800–1,200 kg (Ta heavy; Ti moderate; Cu moderate) depending on target dimensions.

• Container Loading for Logistics Planning:

  • 20′ dry container (max gross ~24 MT): This product occupies ≤0.5 pallet space per 200 kg. → Bulk metal arrangement: Combine with other target materials (e.g., Al, Mo, W) to reach 20 MT consolidated shipment. For single product, typical order size is 50–500 kg per SKU.

• Lead Time: 15 working days after payment and artwork approval. Expedited (5 days) at +25% uplift.

• Incoterms: EXW (Hefei/Ningbo), FOB Shanghai, or CIF major global airport/sea port. Full insurance included for CIF.