Electronic-grade Acetone (SEMICONDUCTOR GRADE)

Description

1. Product Overview

Electronic-grade Acetone (Semiconductor Grade) is an ultra-high-purity solvent engineered specifically for critical wafer fabrication, photoresist stripping, and precision cleaning in cleanroom environments. Its primary industrial use lies in removing residues, water, and organic contaminants from silicon wafers, masks, and other sensitive semiconductor components without introducing trace metals or particles. The key value proposition is defect reduction: achieving >99.99% yield compatibility by eliminating ionic and particulate contamination at the sub-10nm node. Strategically, this product is indispensable as global fabs scale toward 3nm architectures and advanced packaging, where any solvent impurity directly translates to billions in potential scrap risk.

2. Key Specifications & Technical Characteristics

• Chemical composition: Acetone (CH₃COCH₃), CAS 67-64-1, stabilized grade (no residual inhibitors or antioxidants)

• Purity level: ≥99.99% (Semiconductor / VLSI Grade)

  • Individual trace metals: ≤1 ppb (typical: Fe, Cu, Cr, Ni, Na, K, Ca, Al)

  • Particles (≥0.1 µm): ≤10 particles/mL

  • Water content: ≤0.05% (500 ppm)

  • Residue after evaporation: ≤2 ppm

• Physical characteristics: Clear, colorless, volatile liquid; mild characteristic odor; density 0.790–0.793 g/mL @ 20°C; boiling point 56°C; refractive index n²⁰/D 1.359

• Packaging options:

  • 4L HDPE clean-bottle (double-bagged, Class 10 cleanroom fill)

  • 20L stainless steel canister (PTFE-lined cap)

  • 200L drum (electropolished inner surface)

  • ISO tank (bulk, 20MT) for high-volume fabs

• Shelf life: 24 months from date of manufacture when stored ≤30°C in original sealed container, away from light and moisture

3. Core Industrial Applications

• Primary industries: Semiconductor fabrication (foundries, IDMs, OSATs), flat-panel display manufacturing, MEMS, photomask production, and LED epitaxy.

• Specific operational use cases:

  • Post-etch residue removal (ashing clean)

  • Photoresist stripping prior to high-temperature diffusion

  • Final rinse before critical oxide growth

  • Wafer backside cleaning and tool chamber maintenance

• Why this product outperforms alternatives:

  • Compared to IPA: higher solubilization rate for cross-linked photoresist polymers → shorter wet-process cycles (20–30% faster).

  • Compared to standard ACS grade: eliminates micro-arcing caused by sodium/potassium residues → higher die yield per wafer.

  • Cost advantage: reduces rework rate by up to 8% in 300mm fabs, directly improving OEE (Overall Equipment Effectiveness).

4. Competitive Advantages

• Quality consistency: Lot-to-lot stability with SPC control charts; each batch certified by ICP-MS and LPC; full CoA traceable to raw material source.

• Supply reliability: Multiple redundant distillation lines (Asia, Europe, Americas) with 48-hour emergency response inventory buffer for tier-1 customers.

• Logistics capability: Cold-chain optional for tropical climates; ISO 9001:2025 and IATF 16949-compliant packaging lines.

• Price competitiveness: Volume-based tiered pricing with long-term strategic agreements (12–36 months) that outperform spot petrochemical markets by 15–20% at scale.

• Sustainability & compliance: Zero-benzene, zero-phthalates, RoHS/REACH/COO documented; compatible with solvent recycling loops in closed fabs.

• Technical support: Dedicated contamination control engineer assigned per account; failure analysis lab access for residue identification.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): 1 drum (200L) for qualification samples; 4MT for standard purchase orders.

• BULK 20MT Loading capacity:

  • 20-foot ISO tank container: 20MT (net weight) ±2%

  • Container type: Stainless steel, food-grade / chemical-compatible, with nitrogen blanket and bottom discharge valve

  • Loading efficiency: 1 MT per pallet (4 drums per pallet) for break-bulk; full ISO tank occupies 1 TEU slot.