Hydrogen Peroxide (H2O2 SEMI GRADE)

Description

1. Product Overview

Hydrogen Peroxide (H₂O₂ SEMI GRADE) is a high-purity oxidizing agent specifically manufactured for critical semiconductor and electronics manufacturing processes. Its primary industrial use lies in wafer cleaning, photoresist stripping, and printed circuit board (PCB) etching, where trace contaminants cannot be tolerated. The key value proposition is its ultra-low metallic impurity profile, ensuring defect-free yields in advanced node fabrication. Strategically, this product is indispensable for global electronics supply chains, as purity directly correlates with microchip performance and production profitability.

2. Key Specifications & Technical Characteristics

• Chemical Composition: Hydrogen Peroxide (H₂O₂) in deionized water solution

• Purity Level: SEMI Grade (compliant with SEMI C30-1110 standards); typical purity 30% or 31% w/w

• Impurity Limits (max):

  • Aluminum, Antimony, Arsenic, Gold, Iron, etc. < 0.1 ppb per element

  • Anions (Chloride, Nitrate, Phosphate, Sulfate) < 50 ppb

  • Particle count: < 50 particles/mL (≥0.2 µm)

• Physical Characteristics: Clear, colorless liquid; density ~1.11 g/cm³ (at 20°C); non-viscous

• Packaging Options:

  • 200 L HDPE drums (double-bagged, cleanroom-filled)

  • 1000 L IBCs (SEMI-compliant inner surface)

  • ISO tank containers (20 MT capacity, temperature-controlled)

• Shelf Life: 12 months from date of manufacture when stored below 30°C in original unopened container with vented cap

3. Core Industrial Applications

• Primary Industries: Semiconductor fabrication (fabs), flat panel display manufacturing, photovoltaic cell production, advanced PCB assembly.

• Specific Use Cases:

  • Wafer cleaning (RCA standard): Removes organic residues and metal contaminants without substrate damage.

  • Photoresist stripping: Replaces hazardous sulfuric-peroxide mixtures (SPM) with lower cost of ownership.

  • Etching of metal layers: Selectively oxidizes copper and other transition metals in microelectronics.

• Performance vs. Alternatives: Compared to standard technical grade or electronic grade H₂O₂, SEMI GRADE reduces defect density by >90%, directly improving die yield. Unlike ozone-based cleaning, it offers longer bath life and better particle removal efficiency (PRE > 99% for 0.1 µm particles).

• Efficiency/Cost Advantage: Lower chemical consumption (up to 30% reduction) due to stabilized formulation, reducing waste treatment costs.

4. Competitive Advantages

• Quality Consistency: Statistical process control (SPC) at every batch; each shipment includes Certificate of Analysis (CoA) with traceable ICP-MS data.

• Supply Reliability: Multiple manufacturing sites (Asia, Europe, North America) with buffer stock agreements; 99.5% on-time delivery rate over 24 months.

• Logistics Capability: Dedicated H₂O₂-safe fleet with real-time temperature monitoring and hazmat-certified drivers.

• Price Competitiveness: Direct-from-producer pricing eliminates broker margins; volume-based tiered discounts for annual contracts.

• Sustainability: Recyclable packaging take-back program; decomposition to water and oxygen reduces downstream EHS burden.

• Technical Support: 24/7 process engineering consultation; on-site purity validation testing available within 48 hours.

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): BULK 20MT (20 metric tons) per shipment

• Loading Capacity (MT per container):

  • 20-foot ISO tank container: 20 MT net weight

  • 40-foot container (IBCs): 16 MT (16 x 1000 L IBCs)

  • Palletized drums (200L): 14.4 MT per 40-foot container (72 drums)