CMP Slurry (CABOT SS-12)

Description

1. Product Overview

CABOT SS-12 is a high-purity, fumed silica-based chemical mechanical planarization (CMP) slurry, engineered specifically for advanced shallow trench isolation (STI) and dielectric polishing applications in semiconductor fabrication. Its primary industrial use is to deliver exceptional planarization uniformity and defect-free surfaces on 300mm wafer nodes. The key value proposition is a superior combination of high oxide removal rate and outstanding selectivity to silicon nitride, enabling tighter process control. Strategically, this slurry is critical for fabs transitioning to sub-10nm nodes, where yield stability directly depends on CMP performance.

2. Key Specifications & Technical Characteristics

• Chemical Composition: High-purity fumed silica (SiO₂) dispersed in an aqueous, alkaline-stabilized medium

• Purity Level: >99.99% trace metal purity; controlled <10 ppb for critical contaminants (Fe, Cu, Ni, Zn)

• Physical Characteristics:

  • Form: Ready-to-use liquid dispersion

  • Color: Translucent white

  • Mean Primary Particle Size: 85–115 nm

  • Density: 1.28–1.32 g/cm³ (20°C)

  • pH Range: 10.5–11.5

  • Viscosity: <5 cP (25°C)

• Packaging Options: 20 L polyethylene cubitainers, 200 L sealed drums, 1,000 L IBC totes

• Shelf Life: 12 months from date of manufacture when stored at 5–30°C in sealed, unopened containers

3. Core Industrial Applications

• Primary Industries: Semiconductor foundries, integrated device manufacturers (IDMs), advanced packaging houses

• Specific Operational Use Cases:

  • STI CMP for logic and memory devices (7nm–90nm nodes)

  • Interlayer dielectric (ILD) planarization

  • Post-polishing cleaning integration for defect reduction

• Performance vs. Alternatives: Achieves oxide removal rates of 3,000–4,000 Å/min with nitride selectivity >50:1, outperforming conventional ceria-based slurries by 20% in uniformity

• Efficiency & Durability: Lower defect density (<0.05 defects/cm²) reduces post-CMP cleaning steps, lowering cost-of-ownership by up to 15% per wafer pass

4. Competitive Advantages

• Quality Consistency: Lot-to-lot variability <3% (95% confidence interval); ISO 9001:2025 certified with SPC-controlled manufacturing

• Supply Reliability: Global multi-plant production (US, Japan, Germany) with 24/7 buffer stock; average lead time 10 days

• Logistics Capability: Temperature-controlled, hazmat-certified supply chain; real-time tracking via blockchain-enabled portal

• Price Competitiveness: Tier-1 volume pricing available; cost per liter 12–18% below comparable fumed silica slurries (e.g., Fujimi, DuPont)

• Sustainability: Reduced water consumption during formulation; 100% HDPE recyclable packaging; full chemical disclosure available under NDA

• Technical Support: 24/7 process engineering support, on-site qualification assistance, and detailed CMP modeling reports

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): BULK 20MT per single order (or 100 x 200L drums)

• Loading Capacity: 20MT per standard 20-foot dry container; max 22 pallets (each 1,000 kg net) per container with double-stacked IBCs