CMP Polishing Pad (IC1000)

Description

1. Product Overview
The CMP Polishing Pad (IC1000) is a precision-engineered polyurethane pad designed for chemical mechanical planarization in semiconductor and advanced substrate manufacturing. It delivers exceptional defect-free planarization for oxide, STI, and metal CMP processes, directly enabling yield improvement at advanced nodes. Its calibrated grooved architecture and stable mechanical properties reduce within-wafer non-uniformity (WIWNU) by up to 18% compared to standard pads. As fabs push toward 3nm and beyond, the IC1000 is a strategic consumable for maintaining die-to-die uniformity and lowering cost-per-wafer.

2. Key Specifications & Technical Characteristics

• Composition: High-density microporous polyurethane foam, cross-linked, grooved or spiral pattern options

• Purity: Trace metal analysis < 1 ppb (Cu, Fe, Ni) – SEMI S2/S8 compliant

• Physical: Thickness 2.00–2.54 mm ±0.05 mm; Shore D hardness 52–58; porosity 25–35%; compressibility < 1.5% at 7 psi

• Packaging: Class 100 cleanroom-sealed, single-wrapped or twin-stack trays (10 pads/case)

• Shelf Life: 24 months from date of manufacture under < 40°C / < 60% RH

3. Core Industrial Applications

• Primary industries: Semiconductor foundries, IDMs, memory fabs (DRAM, 3D NAND), advanced substrate packaging

• Use cases: Oxide CMP (ILD, IMD), STI CMP, tungsten (W) and copper (Cu) bulk/barrier CMP

• Performance advantage: Consistent removal rate stability (> 500 wafers/pad) with 30% lower defectivity (LPD counts) than open-cell alternatives

• Cost advantage: Reduced pad conditioning frequency extends pad life by ~15%, directly lowering consumables cost per wafer edge

4. Competitive Advantages

• Quality consistency: Inline Fourier-transform infrared (FTIR) and modulus testing on every batch – Cpk > 1.33 for all critical parameters

• Supply reliability: Dual-site manufacturing (Asia, Europe) with 12-week rolling forecast commitment and buffer stock of 15k pads

• Logistics capability: Ambient nitrogen-purged shipments with RFID-trackable pallets; 98% on-time delivery rate over 12 quarters

• Price & sustainability: Tier-1 performance at 8–12% below comparable Dow IC1000 legacy SKUs; pad reclamation program for used material (30% reduced landfill)

5. Commercial & Supply Information

• Minimum Order Quantity (MOQ): BULK 20 MT (approx. 28,000 pads based on 0.7 kg/pad)

• Loading capacity per container: 20 MT per 40-ft HC container (palletized, 22 pallets, each ~900–1,000 kg net)